Intel's making sandwiches now instead of pizzas. Seriously.
, and how it's been performing in Meteor Lake-based test chips, delivering a greater than 5% increase to clock speeds. According to Intel's Ben Sell, vice pres. of technology development, that puts PowerVia on track for delivery next year along with thePowerVia represents a new way to create processors, effectively sandwiching the transistors in the middle of the chip, with the interconnects to the outside world on the front and the power wiring on the back.
In fact Intel has shown the functional benefits of the technology on a"Frankenstein test-chip" called Blue Sky Creek. In reality it's a-based chip using the upcoming generation's Efficient-core, built on the Intel 4 process, but incorporating the PowerVia tech. Just from the addition of backside power delivery, Intel claims that it has managed to add more than 5% frequency improvement to the test chip. If we take the clock speed of the Raptor Lake E-cores as a starting point, that would mean a change from 4.3GHz to 4.5GHz just from shifting around where the interconnects and power wiring goes.
Traditionally, chips are built like pizzas , with the core transistors on the bottom and everything else layered on top, with the power and other interconnects in the final layer. It's then flipped over, and stuck in a package that sits in your motherboard socket to maintain its connection to the outside world.
With backside power delivery, and therefore in Intel's PowerVia, it's more like a sandwich. With the transistors in the middle, the interconnect layer on top, and the power connections on the back behind the transistors.
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