Driving ‘processing power improvements for years to come.’
IBM Research and Tokyo Electron collaborated on a new breakthrough in 3D chipmaking that uses a novel method to keep Moore's Law in motion.
They announced that they successfully implemented the new process for producing 300 mm silicon chip wafers for 3D chip stacking technology. It is the world's first 300 mm level example of this technology.Chip stacking typically requires vertical connections between layers of silicon, called through-silicon vias . The layers are usually extremely thin, having a thickness of less than 100 microns.
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